The battle between team red and blue is rarely dull and that’s most certainly the case if HBM memory supportive EPYC CPU reports are to be believed. Intel looked set to be the only CPU maker in town with HBM powered server CPUs, however, AMD had other plans. Team red is reportedly in the planning stages of its own EPYC Genoa variants which will be based on Zen 4 architecture.
The rumour was originally brought to light from Inpact-Hardware who state that, according to its sources, AMD is planning an HBM variant of its upcoming EYPC Genoa CPU lineup. The new CPU lineup will of course feature Zen 4 core architecture which is set to increase bandwidth-bound workloads – amongst a plethora of other features and benefits.
HBM Memory Support For AMD
According to Inpact-Hardware, EPYC CPUs with HBM Memory support has been a recurring question amongst the AMD partners – with many speculating the reasons why they’ve let Intel beat them to the punch. That said, the Intel Sapphire Rapids aren’t due out till sometime in 2023, so there is still a chance that AMD could beat them to market – albeit incredibly unlikely.
At the time of writing this, AMD is currently working on its Milan-X CPU lineup, an intermediate between Zen 3 and Zen 4 architecture that sees 3D chip stacking technology utilized. That lineup, however, is still a mystery as we still don’t know whether the die stacking will be based around CCD’s or V-cache – something that will likely come to light in the coming weeks.
Best guesses speculate that AMD is likely to offer Milan-X with 3D V-cache to highlight the benefits of low-level cache and how it can actually help boost performance in bandwidth-bound workloads and productivity scenarios. As far as launches go, the difference between Milan and Milan-X is roughly 2-3 quarters – meaning, we’ll likely see a similar gap for the Genoa HBM supportive CPUs as well.
Either way, it’ll be very interesting to see how the HBM implementation will after the battle for server CPU supremacy between the two big powerhouses in the game. Whether or not AMD will implement the technology in traditional off-die methods or change to next-gen 3D chip stacking tech is still yet to be seen.